Contract signing for Hoa Lac High-Tech Park (HHTP) main infrastructure development
-   +   A-   A+     06/07/2015
On June 17, 2015, the HHTP Infrastructure Development Project Management Unit (under the HHTP Management Board) and the consortium of bidders including Taisei Company (Japan); Vinaconex Corporation; and Truong Son Construction Corporation signed the tender package contract No. CP-1A for the development of the main infrastructure under HHTP infrastructure development project.

On June 17, 2015, the HHTP Infrastructure Development Project Management Unit (under the HHTP Management Board) and the consortium of bidders including Taisei Company (Japan); Vinaconex Corporation; and Truong Son Construction Corporation signed the tender package contract No. CP-1A for the development of the main infrastructure under HHTP infrastructure development project. 


Attending the signing ceremony were Dr. Tran Viet Thanh, Vice Minister of Science and Technology, Mr. Pham Dai Duong, Chairman of HHTP Management Board, the leaders of departments under MOST and HHTP Management Board as well as members of bidder consortium.

CP-1A is the biggest tender package in size and value among the four packages under the project of HHTP infrastructure development supported by ODA loans from Japanese Government. As planned, the groundbreaking ceremony of CP-1A Package will officially be held on June 26, 2015 and implemented within 37 months.

Some pictures at the signing ceremony:


Overview of the ceremony



Mr. Taiji Yanai, Head of Taisei Representative Office in Vietnam representing the bidder consortium made a commitment speech on the contract‘s timeline and quality



Mr. Pham Dai Duong, Chairman of HHTP Management Board made a speech at the ceremony



Vice Minister Tran Viet Thanh congratulated and assigned tasks for the HHTP Management Board and the bidder consortium


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